ICKBGA23X23 Fischer Elektronik HEAT SINK, BALL GRID; PACKAGES COOLED:BGA / PLCC; THERMAL RESISTANCE:23 C/W; EXTERNAL HEIGHT - IMPERIAL:0.24; EXTERNAL HEIGHT - METRIC:6MM; EXTERNAL

Part Nnumber
ICKBGA23X23
Description
HEAT SINK, BALL GRID; PACKAGES COOLED:BGA / PLCC; THERMAL RESISTANCE:23 C/W; EXTERNAL HEIGHT - IMPERIAL:0.24; EXTERNAL HEIGHT - METRIC:6MM; EXTERNAL
Producer
Fischer Elektronik
Basic price
8,07 EUR

The product with part number ICKBGA23X23 (HEAT SINK, BALL GRID; PACKAGES COOLED:BGA / PLCC; THERMAL RESISTANCE:23 C/W; EXTERNAL HEIGHT - IMPERIAL:0.24; EXTERNAL HEIGHT - METRIC:6MM; EXTERNAL) is from company Fischer Elektronik and distributed with basic unit price 8,07 EUR. Minimal order quantity is 1 pc.



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(keyword ICKBGA23X23 Fischer Elektronik HEAT SINK, BALL GRID; PACKAGES COOLED:BGA / PLCC; THERMAL RESISTANCE:23 C/W; EXTERNAL HEIGHT - IMPERIAL:0.24; EXTERNAL HEIGHT - METRIC:6MM; EXTERNAL)
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